以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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They sound excellent for both gaming and mixed media usage, largely thanks to the SteelSeries app, which has a huge library of game-specific equalizer presets ready to go for any situation. That more than makes up for the lack of Dolby Atmos, and the spatial audio implementation is great even without the official stamp of approval from Dolby. On the input side, the microphone does a surprisingly good job of filtering out unwanted noise, like a surprise sneeze or my dog barking at the mail carrier. I wouldn't use it for any professional recording sessions, but it sounds clearer than most other gaming headsets at the price.